MDL：
MFCD00150225

Molecular Formula：
Cu2P2O7·xH2O

Molecular Weight：
301.04(anhydrousbasis)

Product order：

Name	Specifications	Packing	Price	Delivery
Copper pyrophosphate hydrate	CP	500g	RMB 132	Consulting service
Copper pyrophosphate hydrate	電鍍級，99%	500g	RMB 159.5	Consulting service

Character：
粉藍(lán)色結(jié)晶粉未，溶于酸，難溶于水，有毒，可與焦磷酸鈉形成復(fù)鹽，對金屬離子具有較強絡(luò)合能力。

Quality Standard：
項目Item                           化學(xué)純
                                    (CP)
含量(Cu2P2O7·3H2O)Assay,%         ≥ 98.0
氯化物(Cl)Chloride,%              ≤ 0.01
鈉(Na)Sodium,%                    ≤ 0.01
鐵(Fe)Iron,%                      ≤ 0.002

品級Grade                          電鍍級  
外觀Appearance                    淡蘭色粉末
純度Purity                        ≥99.0%
Fe                                ≤0.01%
Pb                                ≤0.005%
SO4                               ≤0.60%  

Storage：
用作電鍍添加劑、配制磷酸鹽顏料。